The TGV sapphire wafer with laser-drilled apertures is an advanced substrate material fabricated by forming high-precision through-glass vias (TGV) on single-crystal sapphire (Al₂O₃) substrates via laser or etching processes卓越した硬さ,高温耐性,光学透明性とTGVのマイクロ/ナノ構造の能力を組み合わせています