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商品の詳細:
お支払配送条件:
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| プロジェクト: | 複数の線状のワイヤセール,上部に作業台がある | ダイヤモンドワイヤー径: | 0.1-0.5mm |
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| ワイヤの走行速度: | 2000 (MIX) m/min | ワークステーションの垂直起床筋: | 250mm |
| 貯水タンク: | 300L | 機械の総動力: | ≤92kW |
| 切断方法: | 素材は上から下に揺れながら降り、ダイヤモンドラインの位置は変わりません。 | ||
| ハイライト: | Multi-Wire Cutting Machine,Diamond Multi-Wire Cutting Machine,High-Precision Cutting Machine |
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Diamond Wire/Multi-Wire/High-Speed/High-Precision/Descending/Oscillating Cutting Machine
The diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine is a high-end system specifically designed for precision processing of hard and brittle materials. It integrates multiple advanced functions including multi-wire parallel cutting (1-3m/s operation speed), sub-micron accuracy (±0.01mm), descending feed mechanism, and dynamic oscillating cutting. The machine is suitable for batch processing of semiconductor wafers, optical components, and special ceramics, supporting various materials such as silicon, silicon carbide (SiC), sapphire (Al₂O₃), and quartz, meeting requirements from R&D to mass production.
| Parameter | Specification |
| Project | Multi-line wire saw with workbench on top |
| Maximum workpiece size | ø 204*500mm |
| Main roller coating diameter (Fixed at both ends) | ø 240*510mm (two main rollers) |
| Wire running speed | 2000 (MIX) m/min |
| Diamond wire diameter | 0.1-0.5mm |
| Line storage capacity of supply wheel | 20 (0.25 Diamond wire diameter) km |
| Cutting thickness range | 0.1-1.0mm |
| Cutting accuracy | 0.01mm |
| Vertical lifting stroke of workstation | 250mm |
| Cutting method | The material sways and descends from top to bottom, while the position of the diamond line remains unchanged |
| Cutting feed speed | 0.01-10mm/min |
| Water tank | 300L |
| Cutting fluid | Anti-rust high-efficiency cutting fluid |
| Swing speed | 0.83°/s |
| Air pump pressure | 0.3-3MPa |
| Swing angle | ±8° |
| Maximum cutting tension | 10N-60N (Set minimum unit 0.1N) |
| Cutting depth | 500mm |
| Workstation | 1 |
| Power supply | Three-phase five-wire AC380V/50Hz |
| Total power of machine tool | ≤92kW |
| Main motor (Water circulation cooling) | 22*2kW |
| Wiring motor | 1*2kW |
| Workbench swing motor | 1.3*1kW |
| Tension control motor (Water circulation cooling) | 5.5*2kW |
| Wire release and collection motor | 15*2kW |
| External dimensions (excluding rocker arm box) | 1320*2644*2840mm |
| External dimensions (including rocker arm box) | 1780*2879*2840mm |
| Machine weight | 8000kg |
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Feature
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Description
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Material Characteristics
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Multi-wire efficiency
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200-wire simultaneous processing, 5x productivity improvement
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Silicon ingots (Φ12"), SiC wafers (6")
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High-speed precision
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Cutting speed 1-3m/s, accuracy ±0.01mm
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Sapphire (Mohs 9), quartz (low thermal expansion)
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Descending+oscillating
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Reduces material stress, surface roughness Ra<0.5μm
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Ceramics (AlN/Al₂O₃), optical glass
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Intelligent control
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Real-time monitoring of cutting force/temperature, automatic optimization
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Composite substrates (SiC-on-Si), special crystals
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Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine application fields
1. Semiconductor Manufacturing
2. Photovoltaics
3. Optoelectronics
4. Advanced Materials
Note: Compatible with Si, SiC, sapphire, quartz, and ceramics. Custom solutions available.
1. Q: What is the advantage of oscillating cutting in diamond wire saws?
A: Oscillating cutting (±8°) reduces chipping to <15μm and improves surface finish (Ra<0.5μm) for brittle materials like SiC and sapphire.
2. Q: How fast can multi-wire diamond saws cut silicon wafers?
A: With 200+ wires at 1-3m/s, it cuts 300mm silicon wafers in <2 minutes, boosting productivity 5x vs single-wire saws.
Tags: #Diamond Wire Cutting Machine, #Multi-Wire, #High-Speed, #High-Precision,#Descending, #Oscillatin
コンタクトパーソン: Mr. Wang
電話番号: +8615801942596
