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| ブランド名: | ZMSH |
| モデル番号: | ワイヤーソー装置 |
| MOQ: | 1 |
| 価格: | by case |
| 配達時間: | 3〜6か月 |
| 支払条件: | T/T |
Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting for Sapphire/Ceramics/Marble Materials
The wire saw equipment utilizes a high-speed diamond wire as the cutting tool, where diamond abrasives are fixed onto a metal wire via electroplating or resin bonding, forming a flexible cutting system. Its core value lies in achieving high-precision, low-damage cutting, significantly improving the processing efficiency and material utilization of hard and brittle materials (e.g., sapphire, ceramics, marble), overcoming the limitations of traditional methods in efficiency and accuracy.
| Material Dimension | Sapphire | Ceramics | Marble |
| Core Characteristics | Ultra-high hardness (Mohs 9), high brittleness | High hardness, high elastic modulus | Non-uniform material, contains hard points like quartz |
| Processing Challenges | Prone to edge chipping and cracks | Cutting surface prone to micro-cracks | Uneven cutting surface and edge chipping |
| Key Metrics | Surface roughness can reach Ra<0.5μm | Pursuit of cutting surface integrity, reducing micro-cracks | High cutting efficiency, good slab flatness |
| Application Directions |
LED substrates, optical windows, semiconductor substrates
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Electronic ceramic substrates, packaging materials, structural ceramics
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Architectural decorative slabs, countertops, carving crafts
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The equipment grinds materials through a continuously circulating diamond wire at high speed, with technical focus varying by material:
| Material | Block Cutting | Cross Cutting | Multi-Wire Cutting | Effects |
| Sapphire | Narrow kerf (0.55mm), surface roughness <1μm, reduces material loss | Fast cutting speed, suitable for ingot truncation and shaping | Simultaneous multi-slice cutting enhances efficiency for materials like silicon wafers | |
| Ceramics | Neat cutting surface, minimal edge damage, ideal for standard substrate preparation | Suitable for precision machining of special-shaped components, high flexibility | High-volume production of uniform components with high efficiency | |
| Marble | High cutting efficiency, flat slab surface beneficial for subsequent polishing | Used for block shaping and large slab division | Single cut generates multiple large slabs, suitable for large-scale projects | |
| Parameter | Range/Specification |
| Main Motor Power | 11–75 kW (common models: 22kW, 37kW, 55kW) |
| Wire Speed | 0–40 m/s (high-speed models up to 45 m/s) |
| Maximum Wire Length | 20–150 m (increases with power) |
| Power Supply | Three-phase 380V/50Hz (customizable) |
| Control Method | Automatic/manual, supports CNC or PLC systems |
| Operating Temperature | -15°C ~ +40°C |
ZMSH provides integrated manufacturing and trading solutions, covering equipment selection, process optimization, and after-sales support:
Q1: How does a wire saw equipment achieve precise cutting?
A1: The equipment uses a high-speed diamond-coated wire that acts as a flexible grinding tool, abrasively cutting through materials while maintaining minimal kerf loss and high accuracy due to controlled tension and linear motion.
Q2: What makes wire saws suitable for environmentally sensitive operations?
A2: Wire saws eliminate the need for cooling fluids in many cases, reduce waste generation by up to 80% compared to traditional methods, and operate with lower noise and energy consumption, aligning with green manufacturing standards.
Q3: How do wire saws handle complex shapes or large-scale projects?
A3: With multi-wire configurations, they can simultaneously cut multiple slices from a single block, enabling efficient processing of intricate geometries or massive slabs—ideal for architectural stonework or semiconductor wafer production.
Tags: #Wire Saw Equipment, #Customized, #Vertical/Horizontal/Multi-Wire Cutting, #Sapphire/Ceramics/Marble Materials
